MSME 2027

CFP

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Welcome to Submit!

MSME 2027 is now accepting submissions. Prospective authors are invited to submit their abstract through the Electronic Submission System or via email. Please note that the conference will NOT publish a proceedings volume. Instead, selected high‑quality papers (accepted and presented) will be recommended to to be published in international journals.

Submission Method

Submit your abstract through the following channels:

 

Electronic Submission System

 

Contact Email: msme@smehk.org

Submit Your Abstract

Important Dates

Call for Papers – Topics

The topics of interest are included below, but are not limited to:

  • Advanced Interconnect Materials and Thermal Management Technologies for Chiplet Heterogeneous Integration
  • Single‑Crystal Substrate and Epitaxy Technologies for Ultra‑Wide‑Bandgap Semiconductors (Diamond, Gallium Oxide)
  • Interface Engineering of Solid‑State Batteries and Design of All‑Solid‑State Electrolytes
  • Low‑Loss Dielectric Materials and Reconfigurable Electromagnetic Metamaterials for 6G Communication
  • Degradable Biomedical Metals and 4D Printing for Tissue Engineering
  • High‑Entropy Alloy Design Based on Large Language Models and Automated Experiments
  • Closed‑Loop Recycling and Fibre‑Reinforced Regeneration Technologies for Carbon Fibre Composites
  • Stability Enhancement and Large‑Area Fabrication Processes for Perovskite Photovoltaic Modules
  • Multi‑Material Interface Fusion and In‑Situ Defect Monitoring in Additive Manufacturing (3D Printing)
  • Lightweight High‑Strength and Tough Composite Structural Design for Low‑Altitude Economy